بحث

لوحة تطوير RP2350-PLUS مع رأس مُلاحر مسبقًا ، لوحة MCU التي تشبه PICO استنادًا إلى Offiical RP2350A بتصميم ثنائي النواة والبنية المزدوجة ، متوافقة مع وحدات PI PICO الإضافية ، 4 ميجابايت ذاكرة فلاش

KWD 5.500
KWD 5.500

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مميزات خاصة

  • RP2350-Plus Development Board with Pre-soldered Header, High-performance Pico-like MCU Board Based On Offiical RP2350A Dual-core & Dual-architecture Microcontroller. Compatible with most of the RPi Pico add-on modules.
  • Adopts unique dual-core and dual-architecture design: dual-core Arm Cortex-M33 processor and dual-core Hazard 3 RISC-V processor, flexible clock running up to 150 MHz. 520KB of SRAM, and 4MB of on-board Flash memory. Type-C connector, keeps it up to date, easier to use.
  • Ba--tte-ry recharge/discharge header, suitable for mobile devices. Onboard DC-DC chip MP28164, high efficiency DC-DC buck-boost chip, maximum 2A load current.
  • Castellated module allows soldering directly to carrier boards. USB 1.1 with device and host support. Low-power sleep and dormant modes. Drag-and-drop programming using mass storage over USB.
  • 26 × multi-function GPIO pins. 2 × SPI, 2 × I2C, 2 × UART, 4 × 12-bit ADC, 16 × controllable PWM channels. Accurate clock and timer on-chip. Temperature sensor. Accelerated floating-point libraries on-chip. 12 × Programmable I/O (PIO) state machines for custom peripheral support.
  • Comes with Online Development Resources /User Manual: bit.ly/3OpxKpj

وصف

RP2350-Plus Development Board with Pre-soldered Header, High-performance Pico-like MCU Board Based On RP2350A Dual-core & Dual-architecture Microcontroller. Compatible with most of the RPi Pico add-on modules.

Specifications
Official RP2350A microcontroller chip designed by RPi in the United Kingdom
Adopts unique dual-core and dual-architecture design: dual-core Arm Cortex-M33 processor and dual-core Hazard 3 RISC-V processor, flexible clock running up to 150 MHz
520KB of SRAM, and 4MB of on-board Flash memory
Type-C connector, keeps it up to date, easier to use
Ba--tte-ry recharge/discharge header, suitable for mobile devices
Onboard DC-DC chip MP28164, high efficiency DC-DC buck-boost chip, maximum 2A load current
Castellated module allows soldering directly to carrier boards
USB 1.1 with device and host support
Low-power sleep and dormant modes
Drag-and-drop programming using mass storage over USB
26 × multi-function GPIO pins
2 × SPI, 2 × I2C, 2 × UART, 4 × 12-bit ADC, 16 × controllable PWM channels
Accurate clock andtimer on-chip
Temperature sensor
Accelerated floating-point libraries on-chip
12 × Programmable I/O (PIO) state machines for custom peripheral support

Package Content
RP2350-Plus-M 4MB with pre-soldered header x1

منتجات شبيهه


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