High Thermal Conductivity - With a thermal conductivity rate of 0.975W/m-K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding. It is suitable for all heatsinks without a fixed clip, and can be used for a wide range of applications.
Safe and Non-Toxic - This thermal adhesive is non-electrical conductive, safe, and non-toxic, making it safe for both users and electronic components. It is odorless, moisture-resistant, and non-swelling, ensuring that it does not damage the substrate over time. Important: it is important to note that this thermal glue should not be used between the CPU and heatsink.
Strong Adhesion - This thermal plaster features strong adhesion properties that allow it to bond with most metals and non-metals, ensuring a reliable and long-lasting connection. The strength of the connected buildings is 55 lb, making it a high-performance option that delivers excellent results.
Quick Drying Time - This thermal adhesive cures quickly upon contact with air, with a drying time of approximately 30 minutes at 25℃. This makes it easy and convenient to apply, with minimal downtime required.
Wide Service Temperature Range - With a service temperature range of -60~250 degrees Celsius, this thermal adhesive is suitable for use in a wide range of industries and applications. It has good thermal conductivity and stability, and is ideal for use in electrical appliances, instruments, and other industries that require effective heat dissipation.
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