Koch-Chemie - Micro Cut Pad - Special Sponge for Removing Fine Scratches, Holograms, and Polishing Marks; High Stability; Long-Lasting Compression Hardness; Contours Easily (76mm x 23mm)
Special Features
☑️ High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01
☑️ The short height of 23mm creates low torsion forces, very good handling and the highest level of stability
☑️ The special density of the foam material enables long-lasting compression hardness during polishing
☑️ The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors
☑️ The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier
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