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Thermal Paste HY234 Thermal Compound Paste Thermal Conductivity 4.0W m k Compound Silicone Grease for CPU Heatsink (10g)

KWD 3.500
Brand
Walfront
Category
Fans & Cooling
Weight
25 g
Size10g
– 1 +

Special Features

  • Good Property: 300±101/10mm concentration, 4.0W/m-k thermal conductivity, -50~340℃ instantaneous temperature resistance.
  • Thermal Paste: Comes with low thermal resistance and high thermal conductivity to transfer the heat from CPU to heat sink.
  • Reliable Work: Also has good insulation performance, the thermal paste will not corrode or damage the electrical components.
  • Easy Carrying: Designed to have a large capacity, a compact size and a light weight, both the storage and carrying are easy.
  • Wide in Using: Widely applicable to PC components such as CPU, VGA, chipset, and so on, very safe and practical.

Description

Specification:
Item Type: Thermal Paste
Product Type: HY234
Colour: Pink
Concentration: 300±101/10mm
Thermal Conductivity: 4.0W/m-k
Instantaneous Temperature Resistance: -50~340℃
Thermal Impedance: Working Temperature: -50~200℃
Specific Gravity: >2.75g/cm³
Applicable Accessory: Suitable for PC components such as CPU, VGA, chipset, , etc.
Applications: For network communication equipment, notebook and desktop computers, power conversion equipment, car headlights, control household appliances, components, modules with high thermal conductivity.

How to Use:
Install and use directly.

Package List:
1 xThermal Paste
or1 x Thermal Paste
1 x Scoop

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