This listing is offering a set of thermal pastes for use on laptops, desktops, game stations, etc.
K5-PRO viscous thermal paste & K4-PRO low viscosity thermal paste are developed and produced by Computer Systems laboratories research department. These products were developed as part of C.S. Labs BGA rework research project with the support of Greece and European Union. These products are designed to reduce the chances of BGA component failure for reasons related to overheating.

This offer is for
2 X 10g (20g) packet of K5 PRO high quality / high thermal conductivity gummy thermal paste. Quantity enough for around 20-40 applications.
And
1 X 7g K4-PRO low viscosity / high thermal conductivity thermal paste in a syringe
Computer Systems brand labeled zip bag also includes wood spatula for safe application and instructions flyer.
No expiration date. Infinite storage / service life. Store in closed can and protect from frost and dust. Made in Greece (European Union)
* Computer Systems materials science laboratory testing : Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014)

When you should replace the thermal paste / pads in your computer:

Thermal paste and thermal pads should be replaced every time that the heat sink is removed (for cleaning, upgrade or other maintenance). Replacing the thermal pads and the gummy thermal paste that is used by many manufacturers on the memory chips is very important when the heat sink is removed. If you reuse the same thermal pads or paste it is impossible for the heat sink to fit perfectly again and the component will be overheated and will fail soon.
If your computer is overheated or turns off after a few hours of use. In this case the entire heat sink system must be cleaned immediately and all thermal paste and thermal pads must be replaced, CSGR.