Thermal conductive heatsink copper pad shims kit
[Main Body Material: Copper]. Thermal conductivity: 401W/mK.
40pcs 20mm x 20mm (0.8x0.8 inches) 6 thickness copper pad shim heat sink includes:
7pcs (0.3mm)
7pcs (0.5mm)
7pcs (0.8mm)
7pcs (1mm)
6pcs (1.2mm)
6pcs (1.5mm)
Can be applied as a gap filler, cooler thermal conductive pad in cooling of the Development Boards Laptop CPU VRAM GPU VGA RAM IC Chips PS5 SSD M.2 NVMe 2280, etc