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Easycargo 4pcs 40mm Copper Pad Shim Thermal Kit, Cooler Copper Pad heatsink for Cooling Sony Playstation 3 PS3, 3D Printer, TEC1-12706 Thermoelectric Peltier Module CPU GPU Laptop 40mmx40mmx0.5mm

KWD 4
Brand
Easycargo
Category
Fans & Cooling
Weight
30 g
– 1 +

Special Features

  • Includes 4pcs 40mm copper pad shim, low profile
  • High performance copper thermal pad shim with thermal conductivity of 400 W/m-k
  • Dimension: 40mm x 40mm x 0.5mm / 1.57″ x 1.57″ x 0.02″
  • Unit weight: 7 gram / 0.25 oz.
  • Can be applied for gap filler in cooling of IC Chips, Development Boards Laptop GPU CPU Tec1-12706 etc.

Description

Thermal conductive heatsink copper pad shims
This heat sink kit includes: 4pcs low profile 40mm x 40mm x 0.5mm / 1.57″ x 1.57″ x 0.02″ copper pad shim.

[Main Body Material: Copper]. Thermal conductivity: 401W/mK

Can be applied as a gap filler, thermal conductance in cooling of the Thermoelectric Peltier Module TEC1-12706, 3D printer, Development Boards Laptop GPU IC Chips, etc.

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