Pk-3 Nano Aluminum Thermal Compound is a state of the art cooling compound. Using nano sized aluminum particles, Pk-3 fills in small air bubbles and gaps between the heatsink and processor, maximizing contact and heat transfer. It offers incredible performance for those seeking to gain the greatest cooling gains in their systems.

FEATURES
- High Thermal Conductivity
- Low Thermal Resistance
- Long-Term Stability
- Low Dry-Out
- Non-Corrosive
- Electrically Non-Conductive
- No "burn-in" Time Required

SPECIFICATIONS
Specific Gravity: 2.7 g/cm³
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m-°C
Thermal Impedance: 0.013°C-in2/W

MATERIAL SPECIFICATIONS
AL: 70~88 (wt%)
ZnO: 18~34 (wt%)
Oil: 8~12 (wt%)
Antioxidant: 0.5~2 (wt%)