Specification:
Item Type:Semiconductor Cold Plate
Semiconductor Cold Plate: TEC1-12706
Size:40 x 40 x 3.75mm / 1.57 x 1.57 x 0.15in
Internal Resistance: 2.1~2.4Ω
Highest Temperature Difference: Above 67°C
Rated Voltage: 12V (Vmax. 15V, Starting Current 5.8A)
Working Current: Imax. = 4~4.6A (Rated 12V)
Cooling Power: Up To 50~70Watts
Working Environment: -55~83℃
Sealing Process: Standard 704 Silicone Rubber Seal All Sides
Fan: DC 12V
Conductive module size:60 x 45 x 30mm / 2.36 x 1.77 x 1.18in
Water block size:40 x 40 x 12mm / 1.57 x 1.57 x 0.47in
Fan size:40 x 40 x 10mm / 1.57 x 1.57 x 0.39in

Package List:
1 x Thermal Module (Heat Sink)
1 x Water Block (Water)
1 x TEC1-12706 (Semiconductor Cold Plate)
1 x Thermal Grease
1 x Fan
1 x Aluminum Substrate
1 x Screw Mounting Kit

Note:
1. When the temperature is below -25 ° C, the conduction cooling module will frost.2. TEC1-12706: One side is the cooling side and the other side is the heat sink side.3. A heat sink or water-cooled heat sink must be installed on the heat-dissipating side; otherwise the cool sink will be burned.4. This kit does not include DC power, please prepare it yourself.