*It cannot be used as silicone grease on the CPU. It is a high thermal performance, unique, fully cured thermal management solution for electronic assemblies, this material is not dry out. *It has low viscosity for dispensing use application; this material have good tacky on the heat-sink can be used for application involving auto-dispensing equipment or stencil screen-printing. *Its ideal for rework and field repair situations. Compare with thermal pad this material is can fully fill the gap and good compression, cost saving. It is ROHS compliant and halogen-free, offering extra reassurance in applications where hazardous substances are forbidden.