Silicon Wafer Specification
Method: CZ;
Size: 4inch;
Type: P-Type;
Dopant: B;
Orientation: 100;
Resistivity: 1-10Ω; ;
Thickness: 525um±25;
TTV＜10um ;
Front side: polished;
Backside: etched ;
Package: silicon wafer case ;

*We provide small quantities, special specifications products, and customized services.

*Our products include 1-12 inch silicon wafers (dummy, test, product grade), SiC, GaN, LN & LT and GaAs, InP substrates, etc.

*As a customization service, we can also process silicon wafer oxide film, nitride film, metal film, EPI, custom ultra-thick, ultra-flat, single-sided / double-sided polishing, thinning, dicing service, etc.