The 832Fx black flexible epoxy encapsulating and potting compound is an economical, electronic-grade, two-part system that is flow able. Its cured form is flexible offering excellent physical, chemical, and electrical protection, and providing some small amount of thermal conductivity. It protects against static discharges, thermal shocks, vibrations, and mechanical impacts. It is extremely resistant to environmental humidity, salt water, and harsh chemicals. It also hides and restrict access to Intellectual property by being much harder to remove than standard epoxy encapsulating compounds. Applications & usages the 832Fx flexible epoxy is used to pot or encapsulate printed circuit assemblies in a protective block. The cured epoxy improves reliability, operational range, and lengthens the life of electrical and electronic parts. Attention! If the parts have crystallized, pre-heat at 50 °C [122 °F] until fully re-liquefied. Let cool to room temperature before use.