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3 inch Copper Bond Polishing Puck for Concrete Terrazzo Floor, Set of 3 Grit 30, 3" Copper Resin Hybrid Bond Polishing Pad for Concrete Floor Grinding Machine

KWD 18
Brand
ACTINTOOL
Weight
291 g
StyleGrit 30
– 1 +

Special Features

  • 3 inch copper bond grinding and polishing pad with foam interlayer for concrete, terrazzo floor.
  • 10 mm working thickness for grinders with more than >15 lbs of grinding pressure per polishing pad, overall product thickness 15mm.
  • Pack of 3 pcs.
  • Hybrid bond polishing pad effective at removing scratches left by metal bonds, last longer and work more aggressive than resin bonds.
  • Grinding and honing work for concrete and terrazzo floor
  • Made of premium quality diamond and copper
  • Availabe in grit # 30 #50, #100, #200, #400.

Description

3 inch copper bond floor polishing pad fit with floor grinding machine for the polishing of concrete, terrazzo floor

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