Repairs and seals holes in all rigid substrates within 20 seconds using a two-part bond. Applications Ideal for repairs on all rigid substrates including, but not limited to, the following: Aluminum Copper Brass Steel Stainless Steel Black Iron Galvanized PVC PEX CPVC Do not use on flexible substrates like canvas, rubber or cardboard. How to Use Prepare: Wipe area clean so it is free of oils, refrigerant, etc. with acetone and ensure there is no pressure on the system. Sand: Sand the area around the hole down for sealant application. Apply: Apply Bonding Fluid (A) to the repair area. Coat: Coat Bonding Cells (B) on top of (A). Apply: Apply Bonding Fluid (A) on top of (B). Cure: Bonds are cured after 20 minutes. Clean: For cleaning, wipe acetone over repair area. For large holes: Repeat as needed to fully cover the hole, following the above steps.