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Solder Paste, Electronic Soldering Paste with Flux, Sn64 Bi35 Ag1 Lead-free SMD Solder Paste for PCB IC SMD LED BGA QFN SMT electronics (1.23oz/35g)

KWD 4.500

Brand
BEEYUIHF
Weight
109 g
1 +

Special Features

  • BEEYUIHF #9300 solder paste need to set the temperature of the hot air gun: lead-free solder paste has a low melting point, melting point of 183 degrees, when soldering the hot air gun can be adjusted to 300~350 ℃ (572 ℉~662 ℉) after preheating the PCB first.
  • Alloy composition of solder paste Sn64 Bi35 Ag1: 1% silver content, firmness, conductivity, better gloss, fine viscosity, excellent wettability, does not produce tin beads, very suitable for conventional mobile phone/CPU/IC repair and soldering.
  • SMT processing products the more difficult, the more important the choice of solder paste. #9300 lead-free solder paste, the cream is delicate, point coating uniformity, with excellent electrical properties, in the 0.3mm pitch tiny pads, are able to show excellent and stable printing performance, improve the quality of welding.
  • Silver-containing lead-free medium temperature solder paste: solid solder joints, no bubbles, no cracks, smooth, bright, full. This model has increased granularity and dramatically improved conductivity without a single false solder.
  • #9300 soldering paste Mainly used in the SMT industry for PCB surface electronic components welding repair, BGA chip tinning, wiring soldering, SMD soldering, cell phone repair and so on.
  • How to store the solder paste: Quality guarantee period: 1 year, storage temperature 2~10 °C (35°F~50°F), can be stored for more than one year at room temperature. If the solder paste is not sealed and preserved resulting in a hard paste, please contact after-sales customer service or replace it.

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