BusBoard saves time! It reduces cut traces and jumper wires to speed prototype assembly. The BusBoard zig-zag pattern can be used to to connect DIP IC's and DIL headers pin-to-pin.
Etched high-quality FR4 glass-epoxy circuit board with solder mask to prevent solder bridges.
Single-sided, 1oz/ft2 copper, anti-tarnish coating for easy soldering. Lead free and RoHS compatible.
38 x 62 holes, 76 separate BusBoard traces, 0.037" holes are drilled on 0.1" (2.54mm) centers.
Standard single height (3U) Eurocard/VME size. 3.9" wide, 6.3" long, 1/16" thick (100 x 160 x 1.6mm). Off-the-shelf 3U size enclosures are available.
Description
The BusBoard-3U prototyping circuit board has the BusBoard zig-zag circuit pattern which is great for high connectivity I.C. and connector applications. The pattern allows DIP integrated circuits and DIL headers to be connected pin-to-pin without cutting traces or adding wires. Opposite sides of the IC or connector are on separate tracks to simplify wiring. It's ideal for memory buses and it provides easy power and ground connections for other ICs. Narrow and wide tracks identify the connected pads. Indicator holes show which are the wide tracks from the top side. A soldermask provides easy soldering and prevents solder bridges on tracks. The PCB accepts a 96 pin DIN-41612 VME connector for backplane or board-to-board applications with. Holes for ejector latches are provided.