Plated through hole solder breadboard. Back side has traces routing holes together: 3 power rails + 3-5 pin long rows (2.54mm pitch). Standard 300 mil to 600 mil width DIP packages will fit over power rails into rows. Front side has silk screen markings to show where backside traces connect pins. Plated through holes on 1.27mm and 2.54mm matrix, staggered. Hole pitch of 1.27mm and 2.54mm center-to-center. Pads are 1.5mm diameter (0.059") in size. Holes are 1.00mm (0.039") in diameter. Dimensions: 2.0" x 2.0" x 0.063" PCB construction: FR-4 UL94V-0. PCB operating temperature range: -40C to +130C. PCB reflow maximum temperature: +260C.