Lead-Free / RoHS 3 Compliant / REACH Compliant TSSOP-28-Exp-Pad (4.40 x 9.70 mm body, 0.65 mm pin pitch) stainless steel solder paste stencil. Stencil Dimensions: 0.9" x 1.3" x 0.004" This stencil has been designed to work with the following PCB footprint: Footprint Datasheet: PA0195 Please note: If the stencil footprint has a center thermal pad (shown as a single pad in the PCB and Stencil datasheets), the stencil may contain several smaller apertures (windows) that together align solder paste over the single center pad on the PCB.