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G109 1.2oz 35g Thermal Glue, Thermal Conductive Adhesive, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET 3D Printer Chipset IC High Performance 1.5W/m-K

KWD 5.500
KWD 6

Brand
GENNEL
Category
Fans & Cooling
Weight
41 g
1 +

Special Features

  • Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
  • Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
  • It has good thermal conductivity and wide service temperature range -60~280℃(-76~236℉)
  • Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
  • Package Includes : 1 x GENNEL G109 1.2oz(35g) thermal glue

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