Designed for efficiency and reliability, the EK-Loop Thermal Paste NGP features a very low thermal impedance to ensure effective thermal conductivity and improved system performance
Optimized formula provides superior clamp-resistance and long-term stability and provides stable performance in a temperature range from -20℃ to 125℃
This high quality thermal paste features a user-friendly application. Each package contains a high quality black spatula to help you apply the perfect layer. EK-Loop Thermal Paste NGP user-friendly viscosity is easy to apply and maintains a consistent application without the risk of conductive issues
Packaged in a practical 5 gram (5 gram) syringe, the EK-Loop Thermal Paste NGP is an ideal solution for all Enthusiasts, System Builders and IT Professionals looking for a high performance thermal interface material
Description
EK-Loop Thermal Paste NGP (5g) is a reliable thermal compound optimized for demanding computing environments. Utilizing advanced Nano-Grade Particle (NGP) technology, this thermal paste promotes efficient heat transfer between CPU, GPU, and other chipsets and cooling solutions such as water block and heat sink.
