Heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air.
It sucks the heat away, thus can reduce the risk of hardware failure due to overheating.
High density fins design increases more surface area and performs effective heat transfer.
Widely used for Electronics, Chip, LED, etc.

Specification:
Material: Aluminum 6063
Processing method: Extruded
Exteral Size: 5.90 x 3.34 x 0.86 Inch / 150 x 85 x 21.8mm (L x W x H)

Package Included:
1 x Heatsink

Note：
Please check the Specification table and make sure that the size of the heatsink fits that of your component.
Please allow slight 1-2mm difference due to manual measurement.