Aluminum heatsinks are used for cooling TECs (Peltier Elements), high power LEDs, ICs and other electronic components. The thermal conductivity of the aluminum and the surface area of the fins increases the area of the plate thus provides greater heat transfer.
Reduce the risk of hardware failure due to overheating. Just use thermally conductive adhesive, double-sided thermal tape or a clamp and thermal compound to mount the device to the heatsink. Glue, tape or thermal compound are not included here.
Specifications:
Type: Aluminum Extrusion Heatsink, Unanodized
Material: Aluminium
Size: 100mm x 60mm x 10mm / 3.94" x 2.36" x 0.39" (Approx.）
Number of fins: 16
Fin thickness: 1mm
Baseplate thickness: 2.2mm
Fin pitch: 3.8mm
Weight: 78 grams