APPLICABLE : Designed specifically for Orange Pi Zero 3, with cut outs to correspond to the applicable , ensuring unobstructed .
PASSIVE COOLING: The Cooling case utilizes passive cooling technology to effectively improve motherboard efficiency and maintain better performance.
FAST CONDUCTION: Thermal adhesive design ensures fast heat conduction and strengthens the tight connection between the enclosure case and the motherboard.
STABLE : Cooling heatsink can help reduce the motherboard temperature and maintain stable performance .
ALUMINUM ALLOY: Enclosure case is made of aluminum alloy, which is a strong and shell that effectively defend the motherboard from external shocks and damages.