Phone Cooling Plate Heat Sink Expend Cooling Area for Cooling Fan Reusable Superconducting Silicone Uniform Radiator Pad semiconductor heat sinkFeatures:The cooling pad can cool the CPU and at the same for time.The phone pad is a plate that neutralizes the heat on the back of the mobilephone. It cannot achieve cooling effect when used alone. Please use with semiconductor in order to achieve better results.The adhesive surface is nano-silica gel material, which can be reused after rinsing with water.The phone cooling pad needs to be used with a fan.The cooling pad only,other accessories demo in the picture is not included!Specifications:Material:Aluminum AlloySize:Approx.11x6.2cm/4.33x2.44inColor:BlackPackage Includes:1x PadNote:Please allow 1-2cm errors due to manual measurement,pls make sure that you do not mind before you order. Due to the difference between different monitors, the picture may not reflect the actual color of the item.