Pure Copper Heat Dissipation,Absorb Heat Quickly
Made of pure copper,the thermal conductivity up to 40.1W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum

Minimalist Metal Line Design
Metallic lines,sharp edges and corners, simple and beautiful,Compatible with more devices

Compatible NVMe/NGFF
The product is suitable for M2 SSDs with NVMe/NGFF protocol,compatible with 22X80 size hard drives

Equipped with Two Thermally Conductive Silicon Pad
The heat of the hard disk can be quickly exported through the copper heat sink to protectthe data security of the hard disk

54 Copper Fins Forheat Dissipation (Model 3)
Quickly remove the heat generated by the hard drive,54 copper fins forheat dissipation,increasing the air contactarea (heat dissipation area 21600mm2),fitting the air duct ofthe chassis to quickly remove heat

Model 1:The ulitra-thin design of pure copperis suitable for use in very small spaces,The bottom is stainless steel,not copper.Top copper thickness 3mm
Model 2:The upper and lower all-copper designhas doubled the heat dissipation area,Top copper thickness 5mm
Model 3:Ultra-slim design,a thickness of 8.5mm pure copper fin,The pure copper fin has alarge heat dissipation area of 21600mm2

Model 1:
L:72mm W:23mm H:3mm
Tool-less design Pure copper heat dissipation
Advantages:ultra-thin,not the top graphics card is generally strong
Disadvantages:The heat dissipation has been improved,and the effect is average

Model 2:
L:72mm W:23mm H:5mm
Screw design All pure copper thickens and dissipates heat
Advantages: ultra-thin, firm, versatile and strong
Disadvantages:The heat dissipation has been improved, and the effect is average

Model 3:
L:72mm W:23mm H:8mm
Screw design All pure copper thickens and dissipates heat
Advantages: ultra-thin, firm, large heat dissipation area
Disadvantages: Passive heat dissipation