HIGH THERMAL CONDUCTIVITY: With a thermal conductivity of 0.975W/m-K, this conductive glue can help MOSFETs, LEDs, ICs, GPU chipsets and other electronic components that need to be directly bonded to dissipate heat effectively. It has thermal conductivity and strong adhesion. Helps to effectively disperse heat from the chipset to the heat sink. It is suitable for all heat sinks without retaining clips for a wide range of applications.
SAFE AND NON-CONDUCTIVE: This thermal glue is non-conductive, safe, and non-toxic, making it safe for both users and electronic components. It is odorless, moisture-proof, and non-expanding, which ensures that long-term use will not damage the substrate. IMPORTANT NOTE: It is important to note that this thermal adhesive cannot be used between the CPU and HEATSINK.
STRONG ADHESION: This electrically conductive adhesives has strong adhesion to most metals and non-metals, ensuring a reliable and long-lasting connection. With an adhesive and tensile strength of 2.1 (MPA), it is a high-performance option with excellent results.
Fast drying time: This hot adhesive cures quickly on contact with air, with a drying time of approximately 30 minutes at 25°C. This makes it simple and easy to use, with no downtime. This makes it easy to use with minimal downtime.
Thoughtful After-sales Service: If you are not satisfied with conductive adhesive you received, or if the glue overflows due to the shipping process, please feel free to contact us, and we will be happy to provide you with replacement or refund services.
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