Dow Corning DOWSIL 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability.

142 g Tube.
White, non-flowing, highly filled compound, good thermal conductivity.

Uses
Designed for thermal coupling of electrical devices and PCB assemblies to heat sinks

Benefits
Thermally conductive compound
1 part
Non flowing
No need for ovens or curing
Increases reliability with heat flow away from circuitry components

Dow Corning 340 Thermal Compound is a grease-like silicone material with a high amount of thermally conductive metal oxide fillers.

This compound has high thermal conductivity, low oil bleed and good high temperature stability. The compound can maintain consistency up to about 177°C.

Therefore, it helps to maintain a reliable heat sink seal, which will improve the heat transfer from the electrical/electronic components to the heat sink or chassis.

Dow Corning 340 Thermal Compound is used for bases and mounting bolts of transistors, diodes and thyristor rectifiers. It can also be used for effective thermal connection of many heat sinks that require effective cooling.

Typical Use:Compound provides thermal coupling of electrical/electronic devices to heat sinks, can be applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers.
Brand:DOWSIL
Color:White
Components:1 part
Dielectric Strength:210 V/mil
Flash Point:>101.1 °C
Specific Gravity: 2.1
Thermal Conductivity:0.67 W/mK
Viscosity:542,000
Volume Resistivity:2 x 10^15 ohm-cm