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4PCS 50mm Heatsink 1.97x1.97x0.43 Inch/ 50mmx50mmx11mm Heat Sink Aluminum Cooler with Thermal Blue Sticker Cooling for Peltier Plate Module Router Amplifier Led Chip CPU Power Transistor FET IC

KWD 4.500

Brand
Awxlumv
Category
Fans & Cooling
1 +

Special Features

  • 1. Heatsink Size: 1.97"(L)x1.97"(W)x0.43"(T)/ 50mmx50mmx11mm; Weight: 1.16 oz / 33gram per, 22x10 fins per
  • 2. With Pre Thermal Conductive Tape, easy installation and optimal heat dissipation
  • 3. 6063-T5 aluminum and anodized heat sinks, not easy to be scratched, the fins are not easy to bend;The groove design increases the heat dissipation area and speeds up the heat dissipation
  • 4. This large big aluminum heatsink widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc
  • 5.Includes 4 PCS black 50mm heatsink

Description

Product Description
4pcs 50mm Heatsink Kit 50x50x11mm Aluminum Heat Sinks
Material: 50mm heat sink anodized aluminum
Color: Sliver
Dimension: 50x50x11mm / 1.97 x 1.97 x 0.43 inch (L*W*H)
This 50mm heatsink kit is suitable for a variety of cooling applications such as for electronic, computer, electrical facilities, play a cooling effect, suitable for passive cooling of LED high power electronics voltage regulators etc. Easy to install, Can be used with other devices to cool processors, regulators, etc.
Package: 50 mm Heat sink x 4 pieces
Weight: 1.16 oz / 33gram per piece
Made of high quality Aluminum, good thermal conductivity
Reduce the risk of hardware failure due to overheating
Maximize surface area Designed in contact with the cooling air.The 220pcs fins increase the area of the board and thus provide for greater heat transfer.
Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.
Please make sure that the size of the heat sink fits that of your component
22x10 PCS cooling fins
Heatsink groove pattern
1. Increased Heat Dissipation Area: The grooves significantly increase the surface area of the heatsink, providing more contact points for heat transfer. This expanded dissipation area enhances the cooling capability, allowing for quicker heat dissipation.
2. Accelerated Heat Dissipation: The grooves facilitate improved airflow and turbulent flow around the heatsink. As air passes through these grooves, it disrupts laminar flow, increasing heat transfer efficiency and speeding up the dissipation process.

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