Cooler Master's new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulated properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces. The Thermal Pad can be cut to size perfect for any application, making it extremely convenient, simple and versatile.