Improving Thermal Conductivity: The small heatsink is used for thermal conductivity and aperture filling between the graphics card and the cooling module to improve thermal conductivity.
401w/mk: The heatsink has a thermal conductivity of up to 401w/mk, providing powerful cooling for your equipment.
Copper Material: The small heatsink is made of copper, which is wear and , and has a long service life.
Burr : The copper heatsink has a glossy appearance, glossy edges and corners, no burrs, and is more suitable for your equipment.
Scope of Application: Suitable for desktop, laptop IC chips, graphics cards, CPU, VGA, , VRAM, , M.2 SSD.