Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Transistor Semiconductor Devices with 26 Pieces Fins 150mmx 80mm x 27mm (6.25x3.15x1.06inch)

Special Features

SIZE: Total Size: 150mm x 80mm x 27mm / 6.25'' x 3.15'' x 1.06'' (L*W*H)
Weight : 12 oz ; Base board thickness:6 mm ; Fins board thickness:0.8mm; Fins:26Pcs
Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc
FEATURE: Made of aluminum alloy material, it has a long service life, and corrosion resistance, and the heat dissipation capacity is strong, which can better dissipate heat for various equipment.
FUNCTION: The surface is smooth, which is easy to install.

Description

A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

Specifications:

100% Brand New High Quality

Material: Aluminum

Fins: 26

Quantity: 1

Weight: 12 oz

Package:

1x Aluminum Heat Sink Cooling Fin