The Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.(br)(br) Made of high quantity aluminum, good thermal conductivity.(br)(br) Reduce the risk of hardware failure due to overheating.(br)(br) Designed to maximize its surface area in contact with the cooling air.(br)(br) Light weight and used in applications where weight is a big concern.(br)(br) Widely use for computer, power IC, power electric device, LED light devices, etc.(br)(br) Material: Aluminum(br)(br) Fin: 27(br)(br) Color: Silver(br)(br) Size: 300 x 69 x 36 mm / 11.8 x 2.71 x 1.41 Inch(br)(br) Quantity: 1(br)(br) Weight: 26 oz(br)