Non-Conductive Safety: Formulated without metals and electrically inert, SYY-166 eliminates short-circuit risks while safeguarding CPUs, GPUs, and sensitive electronic components.
Advanced Carbon-Based Performance: Engineered with micronized carbon particles, our compound achieves superior heat transfer efficiency compared to liquid metal solutions, rapidly dissipating intense thermal loads from high-performance processors.
Optimal Thermal Stability: Maintains consistent performance under extreme operating conditions, ensuring maximum heat dissipation capacity even when pushing hardware to its limits.
User-Friendly Application: With smooth viscosity and precise spreadability, both professionals and first-time users can achieve perfect thin-layer coverage without messy residue.
Long-Lasting Reliability: Unlike silicone-based alternatives, this formula maintains its thermal integrity through thermal cycling, delivering stable protection for over 6 years without degradation or reapplication needs.