The 2.4 inch (6 mm) diameter x 6 heat pipes and twin tower design that heats up to 2 blocks, achieves high-end class performance. Fin design with improved compatibility with LGA1700 new retention back plate has been changed to metal
Offset design with a thin 0.6 inch (15 mm) thick fan in the front and the heat sink design is moved back and cut on the top of the fins and rear to reduce interference with the structure on the motherboard for improved compatibility
Compact design with a low height of 6.1 inches (154 mm) and a black sandblasted top cover mounted on the top of the heatsink
The "double reverse method" allows the front fan to rotate counterclockwise and the middle fan is clockwise. Reduces airflow turbulence, increased airflow and static pressure characteristics. Reduces airflow turbulence, improves airflow and static pressure properties
High-end class performance with 6 0.2 inch (6 mm) diameter heat pipes and twin tower design that heat up to 2 blocks.
Sandblast finish black top cover mounted on top of heatsink
Fin design for improved compatibility with less interference
LGA1700 metal back plate for the new type of retention
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